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Thin Film Wiring
Caption:
A researcher at George Tech Center for Low Cost Electronics Packaging is fabricating thin film wiring on a low CTE base substrate using an Anvik[SUP]®[/SUP] Hexscan[SUP][FONTSIZE=(-1)]TM[/font][/SUP]. The research will lead to new substrate materials with properties such as high stiffness greater than 300 GPa, no CTE mismatch with silicon (3.0ppm/C). Researchers also explore new processes in analytical modeling and characterization. This work is funded by the National Science Foundation Engineering Research Center, the electronics industry, and the State of Georgia.
For more information, visit the Georgia Tech Center for Low Cost Packaging Research web site, http://www.prc.gatech.edu.
(Preview Only)
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| Credit: |
Courtesy Georgia Tech Center for Low Cost Electronics Packaging Research; photo by Stanley F. Leary |
| Decade of Image: |
2000 - 2009 |
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Categories:
ENGINEERING / ERCs (Eng. Rsh. Cents.)
Formats Available:
Restrictions:
No additional restrictions--beyond NSF's general restrictions--have been placed on this image. For a list of general restrictions that apply to this and all images in the NSF Image Library, see the section "Conditions".
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