General Information
-
Document Type: |
Presolicitation Notice |
Solicitation Number: |
BAA04-10 |
Posted Date: |
Dec 19, 2003 |
Original Response Date: |
Feb 09, 2004 |
Original Archive Date: |
Dec 19, 2004 |
Current Archive Date: |
|
Classification Code: |
A -- Research & Development |
Contracting Office Address
- Other Defense Agencies, Defense Advanced Research Projects Agency,
Contracts Management Office, 3701 North Fairfax Drive, Arlington, VA,
22203-1714
Description
- Defense Advanced Research Projects Agency (DARPA), Contracts Management
Office (CMO), 3701 North Fairfax Drive, Arlington, VA 22203-1714. A - MEMS
EXCHANGE (MX), SOL BAA 04-10, DUE 020904, POC CLARK T.-C. NGUYEN, DARPA/MTO,
FAX (703) 696-2206 PROGRAM OBJECTIVES AND DESCRIPTION The Defense Advanced
Research Projects Agency (DARPA) is soliciting research proposals in the
area of MEMS Exchange (MX). Proposed research should investigate innovative
approaches that enable revolutionary advances in science, devices or
systems. Specifically excluded is research which primarily results in
evolutionary improvement to the existing state of practice. DARPA is
soliciting innovative proposals in the area of microelectromechanical
systems (MEMS) process module additions to the MEMS Exchange distributed
fabrication network, with the intention of furthering the MEMS Exchange (MX)
program goal of providing flexible access to complex MEMS fabrication
technology in a wide variety of materials and to a broad multi-disciplinary
user base, pursuant to making possible novel devices otherwise unattainable
via inflexible foundries. Although complete, self-contained, multi-mask
process modules that can serve as "standard" processes are of most
interest, single process steps (e.g., a film deposition, an etch capability)
will still be considered if exceptionally novel and compelling. Emphasis
will be given to multi-mask process modules that are amenable to combination
with other modules to yield fully integrated microsystems. Among the
relevant set of technologies deemed beneficial to the MEMS Exchange service
are: (1) generic, widely-applicable, standard processes-e.g.,
surface-micromachining, Silicon On Insulator (SOI) micromachining, metal
micromachining, etc.-that yield fully functional MEMS devices; (2) process
technologies that yield 3-dimensional structures; and (3) generally
applicable technologies capable of packaging MEMS devices under environments
suitable for optimum performance. Given that one of the main objectives of
the MEMS Exchange program is to insure self-sustained operation of the MEMS
Exchange service beyond the end of the program, additional consideration
will likely be given to process modules perceived to be in highest demand or
capable of satisfying a crucial need by any of the DARPA MEMS programs. One
of the drivers behind the interest in self-contained, multi-mask process
modules is to see if a "standard" MEMS process flow can be
identified that is general enough to be used by the majority of MEMS
designers in a given class, yet still capable of attaining performance on
par with or approaching that of a fully custom process. Such a
"universal" MEMS process (or a set of them, one for each
"class"), if even possible, would be highly beneficial to the MEMS
community, since its ability to support a large number of products could
substantially raise the volume of wafers processed per month, thereby
greatly lowering the cost of the process, and thus, of the products it
services. In essence, such a process might allow the MEMS industry to enjoy
the same standardization advantages that the extremely high volume
integrated circuit industry presently enjoys. MEMS devices that harness the
material and process flexibility provided by the MEMS Exchange distributed
fabrication network are expected to enable a myriad of strategic
capabilities. In particular, Micro Electro Mechanical Systems (MEMS)
technology, with its ability to reduce both size and power consumption in a
myriad of sensor, communication, actuation, and information processing
devices, has been identified as a key enabling technology for military
platforms in all areas. Among the many examples of high payoff applications
of MEMS technologies are micromechanical logic circuits for munitions
safe-and-arming devices, micromechanical vibrating resonators for frequency
selection and generation in miniaturized communication transceivers,
programmable micromechanical gratings for remote toxic gas sensors, movable
micromirrors for optical switching, micro fuel cells and engines for
portable, long-lasting power generation, and chip-scale atomic clocks for
portable GPS and ultra-secure communications. The most recent advancements
in MEMS technology have invariably required participation from researchers
from a widely diverse set of backgrounds, many of whom do not have access to
the full spectrum of MEMS technologies. In allowing and encouraging the use
of a wide variety of materials and fabrication processes by a broad
multi-disciplinary user base, the development and enhancement of the MEMS
Exchange should prove instrumental in providing the accessibility to MEMS
technology required for a myriad of present and future MEMS-enabled devices
for military platforms. In addition, MEMS Exchange can serve as a
much-needed fabrication infrastructure for low or medium volume production
of MEMS-enabled products for DoD applications. DARPA strongly encourages
well-coordinated, interdisciplinary research and development activities that
take into consideration all significant and relevant engineering tradeoffs
and optimizations. Teaming among academic, industrial and/or government
partners is encouraged, and it is anticipated that the contributions of the
team members are complementary as well as essential to the critical path of
the research plan. Such teaming, however, is not required, and offerings
from compelling individual efforts will be given the same consideration as
that for teams. A technology insertion plan is encouraged and research that
holds promise of insertion into Department of Defense (DoD) relevance is of
great interest. Additional information on these technology areas is provided
in the Areas of Interest section of the BAA 04-10 Proposer Information
Pamphlet referenced below. PROGRAM SCOPE This addition to the MEMS Exchange
program is meant to support short-term efforts, on the order of one year or
less, that should culminate in the insertion of new process modules into the
MEMS Exchange service that greatly enhance its overall capability and
increase its user base. Several awards in amounts ranging from $100,000 to
$200,000, and all totaling $1 million, are expected to be made during the
second quarter of fiscal year 2004. A web site-http://teaming.sysplan.com/BAA-04-10/
has been established to facilitate formation of teaming arrangements between
interested parties. Specific content, communications, networking, and team
formation are the sole responsibility of the participants. Neither DARPA nor
the Department of Defense (DoD) endorses the destination web site or the
information and organizations contained therein, nor does DARPA or the DoD
exercise any responsibility at the destination. This web site is provided
consistent with the stated purpose of this BAA. Cost sharing is not required
and is not an evaluation criterion, but is encouraged where there is a
reasonable probability of a potential commercial application related to the
proposed research and development effort. Questions concerning this BAA may
be directed to the technical POC for this effort, Dr. Clark T.-C. Nguyen,
phone: (571) 218-4586, fax: (703) 696-2206, electronic mail: cnguyen@darpa.mil.
GENERAL INFORMATION Proposers must obtain a pamphlet entitled "BAA
04-10, MEMS Exchange, Proposer Information Pamphlet" which provides
further information on MEMS Exchange, the submission, evaluation, and
funding processes, proposal formats, and other general information. This
pamphlet may be obtained from the FedBizOpps website: http://www.fedbizopps.gov/,
World Wide Web (WWW) at URL http://www.darpa.mil/ or by fax, electronic
mail, or mail request to the administrative contact address given below.
Proposals not meeting the format described in the pamphlet may not be
reviewed. Proposers must submit an original and seven (7) copies of the
proposal and two electronic copies (i.e., two separate disks) of the
proposal (in PDF - preferred, MS-Word readable, HTML, or ASCII format, each
on a single 3.5 inch High Density MS-DOS formatted 1.44 Megabyte (MB)
diskette, a single 100 MB Iomega Zip disk, or a CD-ROM). Also include on
each disk the one-slide PowerPoint file summarizing your proposal, as
described under the Proposal Format sub-section of Section I of this BAA.
Each disk must be clearly labeled with BAA 04-10, proposer organization,
proposal title (short title recommended) and Copy __ of 2. The proposal
(original and designated number of hard and electronic copies) must be
submitted to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714
(Attn.: BAA 04-10), and must be received by DARPA on or before 4:00 P.M.,
local time, Monday, February 9, 2004, in order to be considered during the
initial round of selections; however, proposals received after this deadline
may be received and evaluated up to one year from date of posting on
FedBizOpps. Proposals submitted after the due date specified in the BAA may
be selected contingent upon the availability of funds. This notice, in
conjunction with the BAA 04-10 Proposer Information Pamphlet, constitutes
the total BAA. No additional information is available, nor will a formal RFP
or other solicitation regarding this announcement be issued. Requests for
the same will be disregarded. The Government reserves the right to select
for award all, some, or none of the proposals received. All responsible
sources capable of satisfying the Government's needs may submit a proposal
which shall be considered by DARPA. Input on technical aspects of the
proposals may be solicited by DARPA from non-Government consultants/experts
who are bound by appropriate non-disclosure requirements. Non-Government
technical consultants/experts will not have access to proposals that are
labeled by their offerors as "Government Only". Historically Black
Colleges and Universities (HBCUs) and Minority Institutions (MIs) are
encouraged to submit proposals and join others in submitting proposals;
however, no portion of this BAA will be set aside for HBCU and MI
participation due to the impracticality of reserving discrete or severable
areas of research in MEMS Exchange. All administrative correspondence and
questions on this solicitation, including requests for information on how to
submit a proposal to this BAA, should be directed to one of the
administrative addresses below; e-mail or fax is preferred. DARPA intends to
use electronic mail and fax for correspondence regarding BAA 04-10.
Proposals may not be submitted by fax or e-mail; any so sent will be
disregarded. DARPA encourages use of the WWW for retrieving the Proposer
Information Pamphlet and any other related information that may subsequently
be provided. EVALUATION CRITERIA Evaluation of proposals will be
accomplished through a technical review of each proposal using the following
criteria, which are listed in descending order of relative importance: (l)
overall scientific and technical merit, (2) potential contribution and
relevance to DARPA mission, (3) plans and capability to accomplish
technology transition, (4) offeror's capabilities and related experience,
and (5) cost realism. Note: cost realism will only be significant in
proposals which have significantly under or over-estimated the cost to
complete their effort. The administrative addresses for this BAA are: Fax:
(703) 351-8616 (Addressed to: DARPA/MTO, BAA 04-10), Electronic Mail:
BAA04-10@darpa.mil Mail: DARPA/MTO, ATTN: BAA 04-10 3701 North Fairfax Drive
Arlington, VA 22203-1714 This announcement and the Proposer Information
Pamphlet may be retrieved via the WWW at URL http://www.darpa.mil/ in the
solicitations area.
Original Point of Contact
- Clark Nguyen, Program Manager, MTO, Phone 5712184586, Fax 7036962206,
Email cnguyen@darpa.mil
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