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Fungal Inoculum Preparation
See also: US Patent Office Full Record

Patent Number: 5786188
Docket Number: 26496
Serial Number: 8658326
Date Patented: 07/28/1998

Fungal Inoculum Preparation

Agency:

Forest Service

Technology Description:

This invention presents a method of preparing fungal inoculum for the bioaugmentation of soils contaminated with hazardous compounds or spawn for use in the edible mushroom industry. The core of this inoculum is a mechanically pelleted substrate that contains both structural and nutritive components. This pelleted core is coated with a hydrophilic material in which fungal propagules are dispersed. With this invention, a new type of carrier of fungal inocula is established that is effective for a variety of applications.

Reference:

Patent Number 5,786,188, which issued July 28, 1998.

Inventors:

Tom Jeffries
USDA Forest Service
Forest Products Laboratory
One Gifford Pinchot Drive
Madison, WI 53705-2398
(608) 231-9453

Richard T. Lamar (Non-Forest Service)

Domen Lestan (Non-Forest Service)

Christine E. Smith (Non-Forest Service)

Diane M. Dietrich
USDA Forest Service
Forest Products Laboratory
One Gifford Pinchot Drive
Madison, WI 53705-2398
(608) 231-9490

 

 

 
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