Patent Number: 6143549
Docket Number: 25298
Serial Number: 9041347
Date Patented: 11/07/2000
Fungal Inoculum Preparation
Agency:
Forest Service
Technology Description:
This invention presents a method of preparing fungal inocula comprising a pelleted substrate coated with fungal propagules suspended in a hydrophilic material. Fungal inoculum is used for propagating fungus for applications such as biological control, fungal spawn, and bioaugmentation. The fungal inoculum of this invention meets criteria for successful commercial production and application to the soil because the inoculum is predominately made from inexpensive agricultural and wood product; the inoculum has sufficient mechanical strength to allow handling and transportation; the material comprising the inoculum can be adjusted to meet the nutrient requirements of particular fungi; and the inoculum has consistent fungal physiological state and resists competition and proliferation from indigenous soil microbes.
Reference:
Please refer to Patent Number 6,143,549, which issued November 7, 2000.
Inventors:
Diane M. Dietrich USDA, Forest Service Forest Products Laboratory One Gifford Pinchot Drive Madison, WI 53705-2398 (608) 231-9490
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Richard T. Lamar (Non-Forest Service)
Christine E. Smith (Non-Forest Service)
Domen Lestan (Non-Forest Service)
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