Flip-chip microelectronic packaging—the technology of attaching bare semiconductor chips directly to circuit boards—is experiencing rapid growth driven by the demand for faster, smaller, and more reliable electronic systems. However, costly manufacturing processes, as well as inadequate manufacturing infrastructure has hindered wide-scale proliferation of flip-chip technology to date. To overcome these barriers the Packaging Research Center at Georgia Institute of Technology (EEC-9402723) implemented an integrated program to advance fundamental science and engineering, develop multi-disciplinary proof-of-concept testbeds, educate a diverse and globally competitive group of students, and collaborate with industry to understand technology needs and product implementation.