The Packaging Research Center at Georgia Tech has taken a leadership position in developing new approaches to education in electronic packaging. With the assistance of an NSF/ERC equipment award matched by The Georgia Research Alliance, the ERC has developed a design/build facility where students further their educations by designing, building and operating new packaging systems with industrial mentors. This is accomplished in two instructional laboratories supplemented by classroom experience. They have developed an interdisciplinary packaging MS certificate and are developing a new, practice-oriented Master’s Program. Supported by NSF, the IEEE and the International Microelectronics Packaging Society, these efforts will develop a broad range of curricular materials/modules for electronic packaging for use by faculty in and outside the ERC. The Director of the Center, Professor Rao Tummala, collaborated with electronic packaging faculty throughout the world to produce the first electronic packaging undergraduate textbook.