The Center for Wireless Integrated Microsystems, a joint ERC among the University of Michigan, Michigan State and Michigan Tech, makes use of state-of-the-art facilities for the fabrication of microsystems and associated devices, including a 7,000 square foot class 10/100 solid-state fabrication facility and specialized facilities for the deposition of diamond films, 3D microfabrication, and micropackaging. The fabrication facilities at the University of Michigan include equipment for the realization of a wide variety of MEMS devices, silicon integrated circuits, and compound semiconductor devices and are operated as part of the Solid-State Electronics Laboratory (SSEL, http://www.eecs.umich.edu/ssel). Diamond deposition facilities are available at Michigan State University and precision facilities for micromilling, embossing, and micromolding are available at Michigan Tech. The SSEL facilities are available to researchers throughout the University of Michigan on an established fee basis as well as to companies and other organizations outside the University. The SSEL is also part of the MEMS Exchange, a distributed MEMS foundry service available nationwide. The estimated value of the investment in these existing facilities is approximately $45 million.