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Cooling Technologies Research Center (CTRC)
Purdue University
A National Science Foundation Industry/University
Cooperative Research Center since 2002
“Improving
the understanding and technology of high-performance heat removal from compact
spaces”
Center Mission and Rationale
The Compact,
High-Performance Cooling Technologies Research Center (CTRC) addresses the
needs of industry members in the area of high-performance heat removal from
compact spaces. Some examples include power electronics, transformers, base
stations in cellular communications, automotive electronics, portable and
wearable electronics, electric vehicle batteries, power distribution systems
in computers, military electronics and avionics, and food processing. In most
cases, the use of sophisticated cooling techniques is a must in view of the
space and performance constraints imposed. Even when compactness is not the
primary concern, use of these techniques can lead to large gains in efficiency
and performance improvements.The CTRC addresses
pre-competitive, longer-term research and development issues in the area of
high-performance heat removal from compact spaces. The agenda for the Center is
set on a yearly basis with research projects identified through a ranking by
all members. Regular updates on the work are made available to members through
a restricted-access web page. The Center meets twice a year to review progress
and choose upcoming projects.
Research Programs
The
research conducted in the Center in the area of compact, high-performance
cooling technologies is driven by industry needs. A list of research projects
is developed based on input from industry, and is continually updated. Research
projects to be adopted are based on ranking by all members. Miniaturization
of cooling technologies is an important common theme running through the
projects. While the projects adopted are driven by existing and potential
practical applications, the emphasis is on obtaining a better understanding
of the “root” of the technology, while addressing specific implementation
questions in a pre-competitive framework.
The scope of the Center’s activities includes research projects which employ a combined experimental/computational approach to arrive at technology development relevant to its industry members, as well as literature surveys, reviews of industry practice, and patent searches, which serve to inform industry members of the latest developments in the application of cooling technologies.
A partial listing of the
envisioned research projects for the Center is provided below, a number of
which are being conducted as ongoing projects:
Thermal
contact resistance prediction and mitigation- Ultra high-performance
carbon nanotube-based interface materials
- Nonconventional and
miniaturized heat pipes
- Microchannel heat sinks
and heat exchangers
- Micropumps
- Phase change energy
storage
- Integration of
microelectromechanical systems (MEMS) at the device level
-
Miniature “smart” piezoelectric fans
- Miniature refrigeration systems
- Nanoscale thermal engineering
- Spray cooling /
evaporative cooling
- Liquid loops and
boiling
- Wick structures and
metal foams
-
Thin-film
evaporation
-
Cryogenic
and low-temperature cooling
-
Molecular
sensors
-
Thermoelectrics
-
Microjets
and jet impingement
-
Heat
transfer in compact heat exchangers
-
Micro/meso pulsed tube
refrigeration
-
Acoustics
and noise control
-
Low-noise fans and
blowers
-
Heat
sink design, characterization and optimization
-
Visualization,
measurement and modeling of heat transfer and flow fields at the local and
system levels
Facilities
The experiments for the Center’s research projects are carried out by its faculty, post-doctoral researchers, and graduate and undergraduate students in a number of laboratories at Purdue, including:
- Microfluidics
Laboratory
- Nanoscale Thermo-Fluids
Laboratory
- Thermal Systems
Research Facilities at Herrick Laboratories
- Acoustics and Noise
Control Facilities at Herrick Laboratories
- Center for Laser
Micro-Fabrication
- Microelectronics
Fabrication Laboratory
- Mechatronics Systems
Research Laboratory
- Dynamic Systems and
Stability Laboratory
- Microsystems
Diagnostics Laboratory
- Aerospace Sciences
Laboratory
- Solid State Materials
and Devices Research Laboratory
- Thermal Management
Research Lab at Villanova University
These facilities contain
state-of-the-art computing and test equipment for fluidic, thermal, and
acoustic measurement and characterization, measurement of material properties,
microfabrication, and numerical simulation.
Membership
Center Headquarters
Purdue University School of
Mechanical Engineering
West Lafayette, IN
47907-2088
Tel (765) 494-5621 Fax (765) 494-0531
sureshg@ecn.purdue.edu
Center Evaluator
Otto C. Doering III
(765)
494-4226*
doering@purdue.edu
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