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NSF Press Release

 


NSF PR 96-26 - May 23, 1996

Media contact:

 George Chartier

 (703) 306-1070

 gchartie@nsf.gov

Program contact:

 Lynn Preston

 (703) 306-1379 Ext. 5231

 lpreston@nsf.gov

This material is available primarily for archival purposes. Telephone numbers or other contact information may be out of date; please see current contact information at media contacts.

NSF Will Invest $48 Million to Spark Four New Engineering Research Centers

The National Science Foundation (NSF) plans to fund new Engineering Research Centers (ERCs) in California, Massachusetts, Michigan and Washington State. The four new awards would bring to 25 the number of NSF-sponsored ERCs nationwide.

NSF intends to award over the next five years $12 million each to the University of Southern California, Massachusetts Institute of Technology, the University of Michigan and the University of Washington to operate the ERCs. ERCs may receive NSF funding for up to 11 years, dependent upon periodic progress reviews.

"The new ERCs will develop the next generation of multimedia technology, create better biomaterials for medical implants, develop a modular system for rapid manufacturing, and improve the way firms integrate design, manufacturing and product development," says Joseph Bordogna, NSF's assistant director for engineering.

"The close collaboration of universities and industry through these ERCs will provide an integrated context for creating new knowledge and educating a new generation of creative, skilled engineers to secure our nation's leadership position in the world marketplace," says Bordogna.

The new NSF Engineering Research Centers are:

Integrated Media Systems Center at the University of Southern California, University Park: Max L. Nikias, director, and Armand Tanguay, deputy director. The center will seek to improve the technologies for combining digital video, digital audio, computer animation, text and graphics as multimedia displays to facilitate the creation, dissemination and realtime interactive access in mixed media. A California study projects that multimedia and creative technologies will represent a new total market of $40 billion by the year 2000, with a wide range of applications in manufacturing, education, vocational training, defense, entertainment, publishing and communication. Some of the center's industrial partners are: Apple Computer, Boss Film Studios, CTV World Television, Digital Equipment Corp., Dolby Laboratories, Fuji-Xerox, Hewlett-Packard, Hitachi America, Hughes Aircraft, IBM, Intel, Lockheed Martin, McDonnell Douglas, Motorola, National Semiconductor, Pacific Bell, SEGA of America, Sierra Monolithics, Silicon Graphics, Tanaka Video and TRW.

Center for Competitive Product Development at the Massachusetts Institute of Technology: Warren P. Seering, director, and John Houser, deputy director. The center is a collaboration between MIT's Engineering School and the institute's Sloan School of Management. In partnership with industry, the center will develop, test and disseminate improved software tools and models for facilitating the integration of engineering and marketing in design and product development. The center will study the processes of gathering accurate information and making correct decisions in bringing a product to market, including such factors as evaluating risk in new technology and translating consumer preferences into technical specifications. Some of the center.s industrial partners are: Alcoa, AT&T, Ford Motor Co., Intel, ITT, Motorola, Navistar International., Polaroid, Sun Microsystems, 3M, United Technologies, Xerox, and Z Corp.

Center for Reconfigurable Machining Systems at the University of Michigan, Ann Arbor: Yoram Koren, director, and Galip Ulsoy, deputy director. The center will develop a new system for manufacturing using hardware and software that can be rearranged quickly and reliably. These new systems will be modular, convertible, customizable, integratable and diagnosable to dramatically reduce the time companies need to launch new products and upgrades. The concept of replacing modular systems holds the potential for any number of industries, but especially automotive, aerospace and computer firms. Some of the center's industrial partners are: Allen Bradley, Boeing, Caterpillar Inc., Chrysler Corp., Cincinnati Milacron Inc., Ford Motor Co., General Motors Corp., HewlettPackard Co., R&B Machine Tool Co., and United Technologies Corp., along with the U.S. Army.

University of Washington Engineered Biomaterials NSF ERC: Buddy D. Ratner, director, and Thomas Horbett, deputy director. The new center will study biological recognition mechanisms to develop a new generation of biomaterials for medical implants that will heal in the body easily and normally. The research aims to correct problems with many biomaterials which the body rejects as foreign, by learning from the healing process how to adjust the composition of the surface of implant materials to make them recognizable to the body. This new generation of engineered materials will be able to interact with specific cell receptors or bind appropriate proteins. Some of the center's industrial sponsors and collaborative partners are: Abbott Laboratories, Bausch & Lomb, Bayer, Johnson & Johnson, Medtronic Promeon, Monsanto, Pfizer Inc., St. Jude Medical, 3M and Wright Medical Technology.

A total of 117 teams applied for the FY96 round of awards. ERCs emphasize the integration of education programs with research activities which, with input from industry, provide new or improved undergraduate and graduate student curricula, research opportunities, and internships with corporate sponsors and collaborative partners.

-NSF-

Attached: List of Engineering Research Centers

Attachment

NATIONAL SCIENCE FOUNDATION ENGINEERING RESEARCH CENTERS
as of June 1, 1996*

State

Institution

Engineering Research Center

AZ**

University of Arizona

Environmentally Benign Semiconductor Mfg.

CA

CA Institute of Tech

Neuromorphic System Eng.

CA

Univ of Southern Calif.

Integrated Media Systems Center*

FL

University of Florida

Particle Science & Technology

GA

GA Inst of Technology

Low Cost Electronic Packaging

CO

University of Colorado/ Colorado State Univ

Optoelectronic Computing Systems

IL

University of Illinois

Compound Semiconductor Microelectronics

IN

Purdue University

Collaborative Manufacturing

MA

Mass. Inst of Tech

Biotechnology Process Eng.

MA

Mass. Inst of Tech

Competitive Product Development*

MD

University of Maryland

Systems Research Center

MI

Univ of Michigan

Reconfigurable Machining Systems*

MN

University of Minnesota

Interfacial Engineering

MS

Mississippi State Univ

Computational Field Simulation

MT

Montana State Univ

Biofilm Engineering

NC

North Carolina State U

Advanced Electronic Materials Processing

NC

Duke University

Emerging Cardiovascular Technologies

OH

Ohio State University

Net Shape Manufacturing

PA

Lehigh University

Advanced Tech. for Large Structural Systems

PA

Carnegie Mellon Univ

Engineering Design

PA

Carnegie Mellon Univ

Data Storage Systems

TX

Texas A&M University & University of Texas - Austin

Offshore Technology

UT

Brigham Young Univ and University of Utah

Advanced Combustion Eng.

WA

Univ of Washington

Engineered Biomaterials*

WI

Univ of Wisconsin

Plasma-Aided Manufacturing

* pending cooperative agreement clearance.
** in cooperation with MIT and Stanford University and in partnership with the Semiconductor Research Corp.

NOTE: NSF also funds State/University/Industry Cooperative Research Centers, State/University Cooperative Research Centers, Science and Technology Centers, Minority Research Centers of Excellence, and Materials Research Science and Engineering Centers.

 

 
 
     
 

 
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