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Image: A researcher at George Tech Center for Low Cost Electronics Packaging is fabricating thin film wiring on a low CTE base substrate using an Anvik[SUP]®[/SUP] Hexscan[SUP][FONTSIZE=(-1)]TM[/font][/SUP]. The research will lead to new substrate materials with properties such as high stiffness greater than 300 GPa, no CTE mismatch with silicon (3.0ppm/C). Researchers also explore new processes in analytical modeling and characterization. This work is funded by the National Science Foundation Engineering Research Center, the electronics industry, and the State of Georgia.<BR> <BR> For more information, visit the Georgia Tech Center for Low Cost Packaging Research web site, http://www.prc.gatech.edu.<BR> Thumbnail

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